Quality control of the bonding state in flip chip mounting, which is essential for high-density implementation of semiconductor packages, can be utilized for improving the manufacturing process!
The "TI-X700i" is a super-fast CT-type X-ray automatic inspection device that enables fully automated inspection of semiconductor package substrates. Aiming for automation and labor-saving in the inspection process, it incorporates advanced technologies such as high-precision motion control and high-speed image processing to meet the demands of inline automatic inspection. Additionally, the JOYSTICK operation input is directly connected to the PLC interface without a PC, enabling timely operations without delay. 【Features】 ■ Achieves faster imaging time ■ Automatically detects defects ■ Easy to operate ■ Maintenance-free *For more details, please download the PDF or feel free to contact us.
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【Main Specifications (Partial)】 ■Compatible Workpieces ・Size: X: 350×Y: 350mm ・Thickness: 6mm or less ・Weight: 5kg or less ■Vertical Clearance ・Top: 7mm ・Bottom: 0mm *For more details, please download the PDF or feel free to contact us.
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At Techno Horizon TaiTech Robotics Division, we aim to address the challenges of "labor shortages" in production sites by pursuing automation and labor-saving solutions. We will deploy safe, secure, and environmentally friendly solutions utilizing motor control technology in the FA industry to contribute to the growth and development of the manufacturing sector.
