Tungsten (W) target purity ≧ 5N
In the electronic components industry, the bonding process is a crucial factor that affects product reliability. Particularly for electronic components exposed to high temperatures and vibrations, the quality of the joints significantly influences product lifespan. Poor bonding can lead to decreased performance and early failure of the product. Our tungsten (W) targets achieve high-quality bonding and contribute to the improvement of electronic component reliability. 【Application Scenarios】 - Bonding of semiconductor devices - Bonding of electronic circuit boards - Electrode formation for electronic components 【Benefits of Implementation】 - High-quality bonding with high-purity tungsten - Improved reliability of joints through uniform film formation - Ability to meet diverse bonding needs with W alloy targets
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basic information
**Features** - High purity W targets for semiconductors - Manufactured using powder metallurgy - Various types of W alloys available - High purity: 3N5 to 5N - Surface roughness ≦ Ra1.6a **Our Strengths** We have established a close cooperative relationship with a Japan-based local factory in China that possesses world-class technology in sputtering targets and bonding services. Through this collaboration, we provide high-quality and cost-effective products and services, accurately capturing customer needs and delivering optimal and top-level products and services.
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【Main Uses】 ■ Semiconductors and Microelectronics ■ Display Panels (OLED/LCD) ■ Aerospace and Nuclear Industry ■ Wear Resistance and Protective Coatings ■ New Energy *For more details, please download the PDF or feel free to contact us.
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Company information
Our company has established a close cooperative relationship with Suzhou Techno-Tech Optoelectronic Materials Co., Ltd., a Japanese-affiliated company with a local factory in China that boasts world-class technology in sputtering targets and bonding services, along with engineers who have many years of experience. We are pursuing further evolution together. Through this collaboration, we propose high-quality and cost-effective products and services. We accurately capture customer needs and provide suitable and top-level products and services. Additionally, we offer cutting-edge products and technologies in semiconductor equipment, materials, and metal products through our extensive network cultivated over many years. Our company aims to support the development of our customers' businesses and grow together, maximizing creativity and technical capabilities to provide new value to our customers.
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