【For Medical Devices】Understand in 3 Minutes! A Substrate That Releases Heat Faster
Explanation of the comparison of thermal vias and copper pins in terms of thermal conductivity, as well as the effects of changing the filling material inside the TH!
In the field of medical devices, there is a simultaneous demand for miniaturization and high performance. In particular, it is necessary to pack many electronic components into a limited space, making the heat dissipation performance of the circuit board crucial. Inadequate heat dissipation can lead to equipment malfunctions and a decrease in lifespan. Our materials on "circuit boards that dissipate heat faster" address these challenges. 【Application Scenarios】 - Miniature medical devices - Portable medical devices - High-density mounted circuit boards 【Effects of Implementation】 - Improved reliability of devices - Extended product lifespan - Achieving miniaturization
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basic information
【Features】 - Comparison of thermal vias and copper pins structure - High thermal conductivity substrate - Comparison of thermal conductivity between thermal vias and copper pins - Effects of changing the filling material in thermal vias 【Our Strengths】 Our company was established in 1977 as a dedicated manufacturer of printed circuit boards. We design, manufacture, assemble components, and produce metal masks for printed wiring boards. With our unique management system, we ensure thorough delivery date management, enabling us to respond to a variety of products with short lead times, and we provide consistent services through a network with strengths in each sales location and region.
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Our company was established in 1977 as a specialized manufacturer of printed circuit boards. Under a thorough delivery management system unique to our company, we achieve a wide variety of products with short delivery times, providing consistent services through a network that has strengths in various sales locations and regions. Please feel free to contact us if you have any inquiries.
