【For Communication】Understand in 3 Minutes! A Circuit Board that Dissipates Heat Faster

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last updated：Jan 20, 2026

Presentation of thermal via and copper pin thermal conductivity comparison materials! Contributing to the acceleration of communication devices.

In the telecommunications industry, with the spread of high-speed data communication, the densification and performance enhancement of circuit boards are progressing. As a result, the heat generation of circuit boards is increasing, making thermal management an important issue. If appropriate thermal measures are not implemented, it may lead to a decline in the performance or failure of communication devices. Our "circuit boards that dissipate heat faster" address this challenge. 【Usage Scenarios】 * High-speed communication routers * Base stations * Servers 【Benefits of Implementation】 * Stable operation of devices due to improved thermal conductivity * Extended product lifespan * Achievement of high performance

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**Features** * Provides comparison materials for thermal vias and copper pins * Offers information on substrates with high heat dissipation * Explanation using graphs, tables, and formulas for thermal conductivity comparison * Discusses the effects of changing the filling material in thermal vias **Our Strengths** We were established in 1977 as a dedicated manufacturer of printed circuit boards. Under a thorough delivery management system unique to our company, we achieve a wide variety of products with short delivery times, providing consistent services through a network with strengths in each sales base and region.