【For Home Appliances】Understand in 3 Minutes! A Circuit Board That Releases Heat Faster
We present materials explaining the comparison of thermal conductivity between thermal vias and copper pins!
In the home appliance industry, there is a demand for longer product lifespans. In particular, heat is one of the major factors that accelerate the deterioration of electronic components. High heat dissipation performance substrates enhance product reliability and contribute to longevity. Our "faster heat-dissipating substrate" addresses this challenge. 【Usage Scenarios】 * Design of home appliances * Improvement of product reliability * Longevity 【Effects of Implementation】 * Reduced risk of product failure * Improved product durability * Increased customer satisfaction
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basic information
**Features** * Structural comparison of thermal vias and copper pins * High thermal conductivity substrate * Comparison of thermal conductivity between thermal vias and copper pins * Effect of changing the filling material in thermal vias **Our Strengths** Our company was established in 1977 as a specialized manufacturer of printed circuit boards. We design, manufacture, assemble components, and produce metal masks for printed wiring boards.
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Our company was established in 1977 as a specialized manufacturer of printed circuit boards. Under a thorough delivery management system unique to our company, we achieve a wide variety of products with short delivery times, providing consistent services through a network that has strengths in various sales locations and regions. Please feel free to contact us if you have any inquiries.
![[Aerospace] Understand in 3 minutes! A substrate that dissipates heat faster.](https://image.mono.ipros.com/public/product/image/2078708/IPROS18117510147851009335.jpg?w=280&h=280)
