A substrate that dissipates heat faster for power electronics.

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last updated：Jan 20, 2026

Presentation of thermal via and copper pin thermal conductivity comparison materials! Supporting high output.

In the power electronics industry, increasing output power is essential for improving product performance and miniaturization. However, with higher output power, the heat dissipation performance of the substrate becomes a challenge. Inadequate heat dissipation raises the risk of performance degradation and failure due to temperature rise in the device. Our products provide materials that explain the comparison of thermal conductivity between thermal vias and copper pins, as well as the effects of changing the filling material within the thermal vias, supporting the design of substrates with high heat dissipation. This contributes to improved product reliability and longevity. 【Usage Scenarios】 - High-output power devices - High-density mounting substrates - Use in high-temperature environments 【Benefits of Implementation】 - Improved heat dissipation performance - Enhanced product reliability - Increased device longevity

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【Features】 - Structural comparison of thermal vias and copper pins - High thermal conductivity substrate - Comparison of thermal conductivity between thermal vias and copper pins - Effects of changing the filling material in thermal vias 【Our Strengths】 We provide total support for the design, manufacturing, component assembly, and metal mask production of printed circuit boards. Since our establishment in 1977, we have achieved small-lot production of various types and quick delivery, offering optimal substrates tailored to our customers' needs.