A substrate that dissipates heat faster for EV chargers.

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last updated：Jan 20, 2026

Presentation of thermal conductivity comparison materials between thermal vias and copper pins! For thermal management of rapid chargers.

In the EV charger industry, heat generation during rapid charging is a significant issue. Particularly during high-power charging, the heat dissipation performance of the substrate becomes a crucial factor that affects charging efficiency and product lifespan. Inadequate heat dissipation can lead to component degradation or failure, potentially compromising the reliability of the charger. Our "faster heat-dissipating substrate" provides materials that explain the structural comparisons of thermal vias and copper pins, as well as the differences in thermal conductivity due to variations in TH fillers, supporting thermal management for EV chargers. 【Usage Scenarios】 - Rapid chargers - High-power charging - Electronic devices requiring thermal management 【Benefits of Implementation】 - Improved heat dissipation - Extended product lifespan - Enhanced charging efficiency

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【Features】 - Structural comparison of thermal vias and copper pins - High thermal conductivity substrate - Comparison of thermal conductivity between thermal vias and copper pins - Effects of changing the filling material in thermal vias 【Our Strengths】 We provide total support for the design, manufacturing, component assembly, and metal mask production of printed circuit boards. Since our establishment in 1977, we have achieved small-lot production of various types and quick delivery times, flexibly responding to our customers' needs.