[Seminar] The Core Points of Solder Connection Reliability and Solder Implementation Technology

In the seminar, I will share my experiences as a "storyteller" regarding quality assurance of automotive electrical components over many years!

We will hold a special seminar titled "The Reliability of Solder Connections and the Core Points of Solder Implementation Technology, as well as Major Failures and Countermeasures - Exploring the Pitfalls of Implementation Technology that Have Been Taken for Granted Until Now." The seminar will provide a detailed explanation based on case studies, data, photographs, and experience regarding the structure of solder connections, temperature profiles, selection of implementation materials, characteristics, reliability, and failure modes of reflow solder, flow solder, lead-free solder, and double-sided mounting, as well as the prediction of solder connection lifespan. This program is designed for implementation design engineers, manufacturing engineers, quality assurance engineers, and others. 【Seminar Overview (Partial)】 ■ Date: March 27, 2026 (Friday) 10:00 AM - 4:50 PM ■ Venue: TH Planning Seminar Room A ■ Participation Fee (including tax): 49,500 yen per person ■ Course Materials: PDF materials (included in the participation fee) *Please apply early as the registration will close once the capacity is reached.

Technical Seminar