[Seminar] Basics and Applications of Plating, and Troubleshooting Measures

Rapid learning in half a day! An explanation of the principles, features, and application examples of various plating technologies used in multiple fields.

We will hold a WEB seminar titled "Basics and Applications of Plating, and Troubleshooting." This seminar will systematically explain the principles and characteristics of various types of plating, including electroplating, electroless plating, molten plating, and dry plating, from the basics, as well as the concepts of materials, processes, and evaluation methods. Additionally, you will efficiently learn about common troubleshooting cases such as adhesion failures and pinholes, along with countermeasures, and practical considerations in light of environmental regulations, all within half a day. This program is designed for engineers involved in design and manufacturing at all manufacturing companies. 【Seminar Overview (Partial)】 ■ Date: April 13, 2026 (Monday) 9:30 AM - 12:30 PM ■ Venue: Online only (Zoom system) ■ Participation Fee (including tax): 38,500 yen per person ■ Course Materials: PDF materials (included in the participation fee) *Please apply early as the registration will close once the capacity is reached.

Technical Seminar