We performed progressive press processing within the same mold using complex and high-difficulty processing techniques!
Lens unit in the rear camera section built into the smartphone "The exterior case components" require high-difficulty processing such as side punching, crushing, barrelling, and small hole punching. Barrel processing that does not affect the product is possible. In addition to various plating options, high-difficulty SUS plating is also available. We performed progressive press processing within the same mold using complex and high-difficulty processing techniques such as top corner crushing, side irregular shape cutting, side small hole processing, and barrelling. 【Processing Technology Examples】 ■ Barrel processing that does not affect the product is possible ■ Various plating options are available, including high-difficulty SUS plating ■ Materials: SPC series / SUS series (304, 305, 316L) / Cu series (brass, phosphor bronze, nickel silver, etc.) ■ Progressive press processing within the same mold using complex and high-difficulty processing techniques *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■ For camera module actuators *For more details, please refer to the PDF document or feel free to contact us.
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Starting with operations at the steelworks, Yoshikawa Industries has reached its 100th anniversary. We continue to take on challenges that break away from existing frameworks. As a challenge outside the steel industry, we established a dedicated manufacturer, Yoshikawa Industries RF Semiconductor Co., Ltd. (1999), and provide a total solution from chip design to tag manufacturing and system integration. Leveraging our 100 years of on-site know-how and expertise in RFID, we will engage with your site through "ICT × Safety × RFID." If you have any issues at your site, please feel free to contact us.
