Ni and Au plating available! The shape can minimize the inner radius.
The "CAP" formed in a tapered shape with the purpose of shifting the hollow part of the ceramic package to the lid side can secure a larger internal volume by adopting an acute angle shape. By transitioning from a multilayer to a single layer, it is possible to reduce package costs. The tapered shape allows for minimizing the inner radius. Additionally, it is effective for ultra-small types such as those below 1210 type, allowing for a cavity on the metal side. 【Processing Technology Examples】 ■ Possible to reduce package costs (multilayer ⇒ single layer) ■ Possible to minimize the inner radius with a tapered shape ■ Compact package size ■ Secure adhesive area ■ Compatible with Ni and Au plating *For more details, please refer to the PDF document or feel free to contact us.
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【Other Examples of Processing Technologies】 ■ It is possible to create a cavity on the metal side ⇒ Effective for ultra-small types such as 1210 type and below ■ Flangeless types can secure a larger bonding area, allowing for increased welding strength *For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■ For crystal, SAW, and sensors *For more details, please refer to the PDF document or feel free to contact us.
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Starting with operations at the steelworks, Yoshikawa Industries has reached its 100th anniversary. We continue to take on challenges that break away from existing frameworks. As a challenge outside the steel industry, we established a dedicated manufacturer, Yoshikawa Industries RF Semiconductor Co., Ltd. (1999), and provide a total solution from chip design to tag manufacturing and system integration. Leveraging our 100 years of on-site know-how and expertise in RFID, we will engage with your site through "ICT × Safety × RFID." If you have any issues at your site, please feel free to contact us.





