Contributing to heat dissipation measures for electronic devices. Solving challenges with short delivery times and high-precision processing.
In the electronics industry, effective heat dissipation measures are essential due to the miniaturization and high performance of products. In particular, electronic components with high-density mounting face an increased risk of performance degradation and failure due to heat. The processing of mold-based cooling holes and heater holes is a crucial factor that influences heat dissipation performance. Our mold base manufacturing and precision gun drilling contract services address these challenges with high-precision deep hole processing and short delivery times. 【Application Scenarios】 - Enclosures for electronic devices - Heat sinks - Cooling plates 【Benefits of Implementation】 - Improved heat dissipation efficiency - Enhanced product reliability - Increased design flexibility
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【Features】 - Compatible with various materials (iron, stainless steel, copper, etc.) - High-precision machining - Machining diameter: φ4.0mm to φ32.0mm - Maximum depth: 1200mm (can accommodate through holes up to 2400mm with special processing) - Short delivery times, including same-day shipping after material arrival 【Our Strengths】 Technical expertise in mold bases and the ability to respond to short delivery times through the expansion of gun drilling machines.
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Our company handles mold bases, inserts, and components. Mold bases serve as the foundation for molds, and each one has a different shape. While meticulously responding to these conditions, we utilize advanced equipment, systems, and our staff's research to meet demands for quality, price, and short delivery times. Please feel free to contact us with your requests.







