Achieve quality stabilization in implementation with high-precision metal masks! We respond to various requests with a rich product lineup.
We offer metal masks compatible with various implementations such as "high-density mounting" and "3D printing." Additionally, our "frameless metal masks" contribute to reducing storage and management costs. 【Main Product List】 ■ Laser Metal Masks for High-Density Mounting - Metal masks for high-precision mounting (Features) Compatible with fine pitch QFPs from 0.33mm to 0.50mm - Metal masks for 03015 component mounting (Features) Minimal printing smudging and low bridge occurrence rate. Sharp opening edges and high paste filling capability. ■ PRO Mask/Nano Mask (Features) Contributes to reducing defect rates in mass production Stabilizes solder volume for extremely small components ■ Metal Masks for 3D Printing (Features) Ideal for printing on "cavity structure substrates" that mount ICs and passive components inside the substrate. ■ PH Mask (Features) Achieves high processing precision and solder release properties with a two-layer structure of metal and plastic. ■ Frameless Mask System "Shippu" (Features) Reduces storage and management costs Reduces replacement costs For more details, please download the catalog or contact us.
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basic information
■Laser Metal Mask This laser metal mask supports fine pitch components with pitch widths of 0.3mm to 0.5mm, as well as high-density mounting of small-sized chip components such as 0603. It is also the mask that can accommodate the shortest delivery times. *Short delivery available! Capable of mounting fine pitch and small-sized chip components!* ■High-Quality Laser Metal Mask This metal mask is more suitable for high-density mounting than conventional laser metal masks. It features an even smoother opening cross-section compared to traditional laser metal masks, achieving excellent solder paste release. *Short delivery available! Capable of supporting fine pitch QFP!* ■Additive Metal Mask This metal mask is designed for high-density surface mounting and can mount fine pitch components with pitch widths of 0.3mm to 0.5mm, as well as small-sized chip components like 0603. The additive metal mask was developed by our company using a unique full additive method. This allows for high-density mounting while achieving a very smooth opening cross-section shape that enhances solder paste release. *Capable of mounting fine pitch and small-sized chip components! *Excellent solder paste release! Custom thickness specifications available.*
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Kyosha Co., Ltd. provides one-stop solutions from PCB design to assembly. Our approach starting from board design allows for maximization of assembly efficiency and optimization of assembly conditions. We cater to both prototype development and mass production, so please feel free to consult us. Additionally, we support our customers' assembly needs with various assembly-related tools, including the highly acclaimed high-temperature adhesive carrier "MagiCarry" and flow soldering transport carriers.