Easy and convenient desktop-type ultrasonic flaw detection imaging device.
Methods for recording images without damaging the internal structure of materials include X-ray testing and ultrasonic testing. Our company is developing an ultrasonic testing imaging device that combines ultrasonic testing with image processing equipment. The ultrasonic testing imaging device has achieved results in a wide range of applications, such as detecting cracks inside semiconductors, distinguishing between adhesion and delamination, detecting voids and delamination in new materials like fine ceramics and composite materials, as well as final inspections of processed parts used in aircraft and inspections of joints with dissimilar metals. D-view (Desktop ultrasonic view-system) is a space-saving, desktop-type ultrasonic testing imaging device that can be easily set up in laboratories or offices. It inherits the usability of our well-established SDS series high-performance ultrasonic scanners and their comprehensive data processing software, making it applicable for material inspections in various fields. Of course, it is equipped with our newly developed high-frequency compatible ultrasonic tester "HIS3."
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basic information
- Discrimination of IC chip delamination and discrimination of bubbles and inclusions within metals are possible. - Objective non-destructive observation is possible with rich image processing and user-friendly operation. - High-frequency flaw detector HIS3 HF - Compatible with Windows 10 - Rich image processing software - LAN compatibility available - Compact design 【Fields】 ◆ Automotive ◆ Electronic components ◆ Target materials ◆ New materials ◆ Research and development
Price information
Please consult us as the price depends on the specifications. For detailed information, please send your inquiry through Ipros or our company website. Website inquiry: https://www.kjtd.co.jp/support/index.html
Price range
P7
Delivery Time
※The delivery date depends on the production status, so please confirm it during our consultation.
Applications/Examples of results
Peeling inspection of IC chips, measurement of internal metal defects, can be used for various applications. Non-destructive testing of peeling by soldering, thickness measurement, sound velocity measurement. Observation of defect shapes.
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Company information
We contribute to the safety and security of society with INDES (Integrated Non-Destructive Evaluation System). (Nihon Krautkramer Co., Ltd. changed its name to KJTD Co., Ltd. on April 1, 2013.) We propose and provide inspection equipment and systems for various non-destructive testing methods, including ultrasonic testing and infrared. 【Products Offered】 - Ultrasonic flaw detectors and ultrasonic testing devices - Ultrasonic transducers and phased array ultrasonic transducers - Ultrasonic leak testers (manufactured by SDT) - Infrared thermal imaging cameras (manufactured by FLIR SYSTEMS) - Active infrared non-destructive testing equipment