Achieving fine pattern processing that was not possible with conventional FPC boards!
【Features】 1. Fine patterning with a pitch of 30μm (L&S = 15/15μm) is possible. 2. Depending on specifications, connection bumps can be formed on the pattern or the backside. 3. By combining laser processing and plating technology, through-hole conduction treatment on both sides is possible.
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basic information
FPC (Flexible Printed Circuit) boards are circuit boards with a polyimide film as the base material, featuring patterned Cu electrodes. Since the base substrate does not use organic materials such as adhesives, it can be used in high-temperature environments. Additionally, using methods such as etching and additive processes, we achieve fine patterning that was not possible with conventional FPC boards. For example, we perform fine patterning with a pitch of 30μm (L&S = 15/15μm). [Configuration] Type: 2-layer FPC (polyimide film + Cu) PI thickness: 25μm, 50μm, etc. Electrode thickness: 3, 5, 8μm, etc. *Compatible with single-sided and double-sided types Protective film: Ni, Au plating, coverlay, etc.
Price information
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Delivery Time
Applications/Examples of results
Various electronic circuits (pitch adapters, connectors, etc.), electrostatic chucks.
Company information
In the future, as represented by MEMS, the research and development department will become indispensable in this industry, where higher precision and greater refinement are increasingly required. Our company will assist with prototyping and development using the know-how we have cultivated over many years. We look forward to inquiries from all industries, not just in the fields of electronics and optics.
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