3D electrode pattern using photolithography technology
The minimum line width that can be produced varies depending on the pattern, substrate shape, and material, so please consult us separately. We can accommodate substrate materials such as resin, glass, ceramics, and silicon according to your specified requirements.
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basic information
We accept the production of three-dimensional circuit formation represented by MID using photolithography technology (film formation, plating, etching). By integrating the substrate and electrode patterns, we can achieve miniaturization, lightweight design, and cost reduction of the products.
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Applications/Examples of results
Specifications of the sample image Substrate: Glass Film type: Cr/Au Film thickness: 5000Å (total thickness) Pattern L/S = 40μm/30μm
Company information
In the future, as represented by MEMS, the research and development department will become indispensable in this industry, where higher precision and greater refinement are increasingly required. Our company will assist with prototyping and development using the know-how we have cultivated over many years. We look forward to inquiries from all industries, not just in the fields of electronics and optics.
