Automatic dip coater for pattern resist application
This device is a fully automatic dip coater (dip coating) that automatically performs continuous dip coating, drying, and cooling of pattern resist as a substitute for dry film on a flat copper plate in the printed circuit board manufacturing process.
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basic information
【Main Specifications】 1. Stroke: 650mm 2. Target Size: W:620×H:510×t1.6 3. Target Material: Copper Plate 4. Dip Speed: 1.0mm–50mm/sec 5. Coating Liquid Circulation: Yes 6. Coating Liquid Temperature Control: Yes 7. Filter Mesh: Yes 8. Drying Section: Yes 9. Drying Temperature: 100℃ 10. HEPA Unit: Yes 11. Equipment Size (Approximate): W:8500×D:2000×H:2550mm
Price information
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Applications/Examples of results
Coating of resist on printed circuit board substrates, etc.
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