Chemical polishing of rust and grease on the surface of the copper foil of the substrate.
Dobreit, ideal for removing copper foil stains from cut substrates.
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basic information
【Features】 □ Chemically polish the copper foil surface of the cut substrate to dissolve the copper oxide film and remove oils, fingerprints, etc. □ pH value / below 1 (strongly acidic) ● For other functions and details, please download the catalog.
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Applications/Examples of results
【Purpose】 □ For removing copper foil dirt from cut circuit boards.
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