Inspection device that significantly reduces the measurement time of temperature characteristics for MEMS pressure sensors.
The "MEMS Pressure Sensor High-Speed Temperature Characterization Testing Device" is a device that allows for high-speed temperature characterization of MEMS pressure sensors through a built-in cooling and heating plate with a pressure control method (patent pending). By employing a method that incorporates the cooling and heating plate within a pressure control chamber, it can conduct tests at three temperatures and three pressures in just 30 minutes. Additionally, by utilizing this cooling and heating plate mechanism, the time required for temperature characterization tests other than pressure can also be significantly reduced. 【Features】 - Adoption of bump probes enables a small mounting area - Capable of conducting tests at three temperatures and three pressures in 30 minutes *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■Temperature Range ・Low Temperature Range: -40 to 0℃ ・Room Temperature Range: +20 to +40℃ ・High Temperature Range: +60 to +150℃ ■Temperature Distribution: Within ±1℃ ■Pressure Range (1): 13KPa to 120KPa (absolute pressure) Pressure variation within ±0.05KPa ■Pressure Range (2): 1 atmosphere to 6 atmospheres Pressure variation within ±0.02 atmosphere ■Measurement Conditions: To be determined through consultation *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company, though with limited capabilities, aims to expand beyond the current fields of electronics and mechatronics, and we aspire to contribute to the development of the next generation by creating systems that are fundamentally operated by humans as the main characters, while continuously delivering products that embody this commitment to the world.