EES package

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last updated：Dec 11, 2017

ラポールシステム

Official site

Check if the semiconductor manufacturing equipment is functioning properly with equipment data! A system package that improves the reliability and productivity of the equipment.

The "EES Package" is a package designed to build an EES (Equipment Engineering System) at a low cost, aimed at improving the productivity of equipment. No need for users to create communication programs; only the necessary parameter settings are required. It is also easy to connect to existing systems. Additionally, it is possible to define events triggered by changes in parameter values based on metadata definitions (parameter lists/event collection/trace collection). 【Features】 ■ No need for users to create communication programs ■ Easy to implement and connect to existing systems ■ Ability to define events triggered by changes in parameter values ■ Capability to store data from the past six months ■ One package per equipment unit ■ Operating environment: Windows 2000/XP/7 *For more details, please refer to the PDF document or feel free to contact us.

Related Link - http://www.lapole.co.jp/html/ees.html

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basic information

【Functionality】 ■ Real-time display of specified SVID and AIO/DIO ■ Capability for direct device collection via A/D converter connection, in addition to standard sampling collection with S1F3 (optional) ■ Selection of behavior when limits are exceeded (optional) ■ Ability to send CSV data via FTP (optional) 【Benefits of Implementation】 ■ Improved engineering efficiency ■ Reduced scrap ■ Increased yield ■ Enhanced equipment operating rate *For more details, please refer to the PDF document or feel free to contact us.