It contributes to the labor-saving of temperature characteristic testing at the wafer level and package level of laser diodes.
There are wafer-level types and package-level types.
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basic information
● Laser Diode Wafer Level Aging Device MODEL: LDA-W007 This is a semi-automatic probing device that achieves continuous heating and output measurement at +250℃. 【Specifications】 Aging Temperature: Rt+20℃ to +250℃ ● Laser Diode Package Level Aging Device MODEL: LDA-P008 Contributes to labor-saving in temperature characteristic testing of power supply, optical power, and current characteristics. 【Specifications】 Aging Temperature: -20℃ to +150℃ ◆◇◆ For more details, please request materials or contact us ◆◇◆
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Our company, though with limited capabilities, aims to expand beyond the current fields of electronics and mechatronics, and we aspire to contribute to the development of the next generation by creating systems that are fundamentally operated by humans as the main characters, while continuously delivering products that embody this commitment to the world.
