Ultra-vibration flow technology has achieved plating speeds more than twice that of conventional methods!! Plating in any small hole is possible (barrel and rack).
This is a next-generation plating device with high productivity that transmits vibrations with an output of 20Hz to 40Hz to a multi-stage diaphragm equipped with a special mechanism. The ultra-vibrations of the diaphragm create a uniform high-speed turbulent agitation of the liquid in the surface treatment tank, completely resolving the shortcomings of conventional bubble agitation. Additionally, by introducing advanced agitation technology to plating solutions that cannot be agitated by bubbles, it achieves more than double the speed and high-quality plating technology compared to traditional methods, marking a significant leap and advancement in revolutionary plating technology.
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**Features** - Current density is 4A to 6A/dm² (about twice that of conventional methods). - For printed circuit boards, the standard deviation (σ) of the plating thickness is between 1.4 and 1.5. - Glossiness is superior to that achieved by foam agitation. - For through-hole substrates, the electrowettability inside the holes improves (throwing power over 85%). - No burning or scorching occurs at points of current concentration, even at high current densities. - The de-foaming effect is outstanding, resulting in very few pit defects caused by gas accumulation. - The combination of micro-aeration and ultra-vibrational flow technology significantly improves electrowetting uniformity. For more details, please contact us or download the catalog.
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Applications/Examples of results
Small components including connector pins, sintered alloy semiconductor chips, buttons, and blind holes.
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