Excellent through-hole finish with low silver and no silver solder.
Excellent through-hole finish with lead-free and no-lead solder.
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basic information
【Features】 ○ Low silver and no silver solder ○ Dramatically reduces solder spattering during pre-soldering processes ○ Suppresses flux aggregation ○ Enables stable bumping ○ Ideal for bumping using plating methods ○ Non-halogen and high reliability ● For more details, please contact us or download the catalog.
Price information
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Applications/Examples of results
Flow soldering assembly products, small coils and transformers, wafer bumping products for spin coating, and various assembly products using pin transfer.
Company information
With the policy of being "earth-friendly," we provide flux cleaning agents that replace halogen-based organic solvents, various cleaning agents for processed parts, and a no-clean type flux using new modified rosin.
![Tin ingot [purity 96% to 99.999%] / recycled product](https://image.mono.ipros.com/public/product/image/0b0/2001537831/IPROS11164551567417570963.png?w=280&h=280)
