This is a flat thermal bonding testing machine that allows for arbitrary settings of heat bonding conditions for heat sealing.
- This is a machine (flat heat sealing tester) used to evaluate the thermal adhesive strength of materials such as cellophane and plastic film. - Heat sealing can be performed by arbitrarily setting the heat sealing conditions (temperature, pressure, time). - It is easy to operate as it is pressurized by an air cylinder. 【About Catalog Download】 Please request the catalog from the related links below or by contacting us. *For products that do not have a standalone catalog, please request the comprehensive catalog.
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■Seal surface : Width Min. 5 mm ～ Max. 20 mm, Length 300 mm ■Temperature : Max. 300 °C *Please specify the operating temperature. ■Pressurization method : Air cylinder type, Stroke Max. 45 mm ■Pressure gauge : Max. 0.5 MPa (Scale 0.01 MPa) ■Timer : Max. 99.99 sec ■Accessories : Foot switch ■Options : Safety cover, Hot tack measurement jig, Test specimen holding plate, Air compressor ■Power supply : AC 100 V, Single phase, 15 A, 50/60 Hz ■Air source : 0.5 MPa or more ■Dimensions & Weight Main unit: Approx. W450 × D385 × H650 mm・Approx. 105 kg Control panel: Approx. W230 × D450 × H515 mm・Approx. 15 kg
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At Yasuda Seiki Manufacturing, we guarantee quality through test data and are making steady efforts to create testing machines that solve various issues in quality control. Many of these conform to global standards and meet the essential requirements of the borderless era. Please utilize the innovative physical property testing machines from "YASUDA SEIKI" for your company's quality control and research and development.