The ice socket achieves device temperature control during burn-in with a low-cost and flexible approach.
Due to the increase in heat generation of devices associated with advancements in semiconductor technology, controlling device temperature has become a significant factor affecting the yield and throughput of the burn-in process, and ultimately the productivity of the devices. The iso-socket provides a solution to control the temperature of devices individually for each site in order to manage the variation in heat generation during burn-in. This solution enables a substantial improvement in yield and productivity during the burn-in process, achievable with the smallest possible cost burden. In other words, it allows standard burn-in equipment to achieve efficiency comparable to high-end burn-in equipment equipped with active temperature control systems.
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basic information
The iso-socket uses Wells C.T.I.'s unique technology to individually monitor and control the device temperature within the socket. - It can be easily installed on individual sockets on the PCB. - The individual control board provides accurate temperature stabilization in the shortest time. - It keeps the temperature setting error within ±3℃. - Continuous temperature readings are possible, even when temperature control is off. - Operating parameters can be programmed through the I2C interface. - All iso-sockets on the board can be powered by a high-current 48V power supply. - Burn-in sockets that can be directly connected to the iso-socket system are also available. =================== ★ For more details, please refer to the materials and catalog. ===================
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Applications/Examples of results
It can be used for semiconductor burn-in, reliability testing, characteristic evaluation testing, etc.
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SensorTa Technologies Japan, Inc., QINEX Division, joined the North American Boyd Corp group in August 2022 and became Boyd Technologies Japan LLC.