Reinforcement plate adhesive (semi-cured) sheet BS
■The processing method is simple. Adhesion is possible with roll lamination and after curing. ■Excellent moisture resistance. ■Ideal for bonding polyimide film substrate flexible printed circuits and reinforcement plates. ■Maintains long-term life.
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basic information
■The processing method is simple. Adhesion is possible with roll lamination and after curing. ■Excellent moisture resistance. ■Ideal for bonding polyimide film substrate flexible printed circuits and reinforcement plates. ■Long-term life can be maintained.
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I want to develop technologies that shine brightly, even if they are small. Since its founding, Nikkankogyo has cultivated core technologies in "coating," "laminating," and "stacking." Our fundamental stance is to respond to the technologies that our customers seek. We always focus on our customers' future needs and create products with new ideas and unique technological development capabilities. This USER-ORIENTED spirit permeates all of our business processes. As product needs change rapidly and development cycles shorten year by year, we possess the insight to anticipate the future and dedicate ourselves to the technological development that brings those ideas to life.