BGA visual inspection system
This is a completely new system with excellent operability and flexibility that allows for visual inspection of solder ball joints such as implemented BGA, uBGA, CSP, and Flip-Flop. The system can be set up in a short time and can be visually inspected as still images or videos through manual operation or stand-alone operation.
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basic information
This is a completely new system with excellent operability and flexibility that allows visual inspection of solder ball joints for implemented BGA, uBGA, CSP, Flip-Flop, etc. The system can be set up in a short time and can be visually inspected as still images or videos through manual operation or stand-alone operation.
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Applications/Examples of results
Check the soldering condition of the substrate (3D display), visual inspection of the ball grid junctions, diameter measurement, inspection of scratches and damaged areas, and check the condition of connectors, cables, and wiring. Additionally, observe mechanical parts, the interior of engines, and flora and fauna.
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Company information
The electronics industry is experiencing fierce developments towards speed, cost performance, communication, labor saving, originality, and the creation of new value. We are committed to contributing to the improvement of product completeness by resonating with our customers on the front lines, through proposals for various board inspection equipment, the development of function testers, and the development and manufacturing of various jigs (fixtures).