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【Features of Manufacturing Services】 ● Capable of SMD mounting on ultra-large substrates Substrate size: Minimum 50(W) × 50(L) × 1(t) mm / Maximum 460(W) × 510(L) × 3(t) mm ● Achieving high precision and high-density mounting - Minimum chip size: 0402 - QFP minimum pin pitch: 0.2mm - BGA minimum ball pitch: 0.25mm ● Soldering - In response to the issue of lead contamination in the environment (products using lead are subject to regulation), lead-free reflow and wave soldering ovens have been introduced. - No-clean processes are implemented in an N2 (nitrogen) atmosphere, compatible with reflow ovens and automatic soldering baths. - A separate building is completely isolated for lead-free manual soldering work areas to prevent contamination with leaded solder. For more details, please contact us.
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【Features of Manufacturing Services】 ● Capable of SMD mounting on ultra-large substrates Substrate size: Minimum 50(W) × 50(L) × 1(t) mm / Maximum 460(W) × 510(L) × 3(t) mm ● Achieving high precision and high-density mounting - Minimum chip size: 0402 - QFP minimum pin pitch: 0.2mm - BGA minimum ball pitch: 0.25mm ● Soldering - To address the issue of lead contamination in the environment (products using lead are subject to regulation), lead-free reflow and wave soldering ovens have been introduced. - A no-clean process is implemented in a nitrogen (N2) atmosphere, compatible with reflow ovens and automatic soldering baths. - A separate building is completely isolated for lead-free manual soldering work areas to prevent contamination with leaded solder. For more details, please contact us.
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Our company provides high-quality services to client companies, from the development and design of industrial electronic devices to production at our own factory. We offer a one-stop service for all forms of DMS (Design & Manufacturing Service) tailored to customer needs, including the development and design of large-scale high-speed circuit boards and system racks, primarily focused on A/D, D/A, DSP, and FPGA-related products, as well as integration proposals with advanced overseas products.
