For interposers and MEMS package applications! Customizable to desired shape, size, and number of layers.
KLC is a substrate, package, and interposer for modules made from LTCC (Low-Temperature Co-fired Ceramic). By specifying the desired shape, size, and number of layers, it is possible to form cavities with high flatness and dimensional accuracy, making it effective as a ceramic package for mounting bare chips. In addition to applications for interposers and MEMS packages, we actively respond to small quantity demands such as prototypes for research and development and evaluation tests for semiconductor chips. Furthermore, we can accommodate post-processing such as chip mounting, component mounting, wire bonding, resin sealing, and ball mounting using our own component mounting line, depending on your needs. *For more details, please refer to the PDF document or feel free to contact us.
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basic information
Can accommodate the shape, size, and number of layers of your choice.
Price range
Delivery Time
Applications/Examples of results
・High-frequency communication module ・Interposer ・Sensor package
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Company information
●Total Supplier of Passive Components Since its founding in 1940, we have strengthened our development capabilities based on foundational technologies such as material technology, processing technology, and evaluation technology, expanding our fixed resistor business. We uphold "Quality 1st" as our management policy and create a business model that proposes new value while offering high-precision and highly reliable electronic components.
