By measuring the substrate distortion with a sensor, the internal stress of the plating can be measured in real time.
It is possible to measure the stress at each plating time (film thickness) with a single measurement. Additionally, stress measurements can be conducted when re-plating on a previously plated film. It can measure fine stresses that conventional stress meters could not detect. It is used by inserting a dedicated stress meter board into the slot of the precision plating power supply YPP series.
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basic information
● Complies with JIS H8626 standards. ● Can measure even weak stress. Suitable for measuring weak products such as films and wafers. (Precise measurements can be made from a film thickness of 0.5μm or more.) ● Can measure initial stress that cannot be measured by other methods. ● Suitable for fine components. ● Data obtained from the sensor is immediately input into a PC connected to the power supply, automatically calculating stress values without the need for manual calculations. Additionally, data during measurement is displayed and accumulated in real-time using a computer.
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Company information
Yamamoto Plating Testing Equipment is a specialized manufacturer of testing devices, analyzers, and small research equipment for plating. Utilizing the know-how cultivated since 1950 and over 1,000 products, we create the "one and only" solution tailored to your needs. We support a wide range of research in fields such as biomedical engineering and aerospace, leveraging our technology not only in plating but also in handling liquids. We manufacture and sell mainly small plating equipment, including Harsel testing devices and analyzers, as well as plating equipment for barrels and wafers, and brush plating tools.
