Lead-free material with added Cu powder that ensures bonding strength at temperatures above 250℃.
This is an announcement about the "RAM Series" from Senju Metal Industry Co., Ltd.
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basic information
【Features】 ○ Maintains bonding strength at temperatures above 250°C, which was previously impossible. ○ A composite material made of copper powder and medium-temperature lead-free solder (Sn-3Ag-0.5Cu) powder. ○ Bonding is possible within the reflow temperature range of medium-temperature lead-free solder. ○ Secondary mounting is possible within the working temperature range of medium-temperature lead-free solder. ● For more details, please contact us or download the catalog (digest version).
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Company information
**Environmental Philosophy** Our company recognizes that the preservation of the global environment is a crucial mission shared by all humanity. Under this mission, we will do our utmost to contribute to the formation of a circular society by harmonizing nature with our business activities and leaving a rich Earth for future generations. **Environmental Policy** 1. We will comply with environmental-related laws and regulations and strive to achieve self-imposed management standards as necessary. We will also adhere to commitments made in environmental agreements with local communities. 2. We will establish the following key themes, which have a significant impact on the environment, as priorities in our business activities: 1) Promotion of energy conservation and resource saving 2) Reduction of waste emissions 3) Reduction of the use of specified chemical substances 3. We will promote environmental management activities based on ISO 14001, focusing on continuous improvement and pollution prevention. 4. We will communicate with the local community and cooperate in creating towns that are friendly to both people and nature. 5. We will set environmental objectives and targets and review them as necessary.