Industry-Academia-Government Collaborative Research and Development
Innovation and commercialization support through close collaboration with various research institutions 【Features】 ○ We contribute to societal development through various engagements, including the embodiment of research theories, development of research equipment, application to social needs, development of dedicated production facilities, and promotion of commercialization. ○ Our field is not limited to electronics; we are also practicing technological integration with the medical field, represented by "biochips," and are engaged in research and development across different fields. ● Similar initiatives can be considered for inter-company collaboration, so please feel free to consult with us first. (We will discuss the details under a mutual non-disclosure agreement.)
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Innovation and commercialization support through close collaboration with various research institutions 【Features】 ○ We contribute to societal development through various engagements, including the embodiment of research theories, development of research equipment, application to social needs, development of dedicated production facilities, and promotion of commercialization. ○ Our field is not limited to electronics; we are also practicing technological integration with the medical field, represented by 'biochips,' and are engaged in research and development across different fields. ● Similar initiatives can be considered for inter-company collaboration, so please feel free to consult with us first. (We will discuss the details under a mutual non-disclosure agreement.)
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Applications/Examples of results
[Public Examples of In-House Technology Development] - We have advanced joint research on the method of forming circuits with a coaxial structure and its characteristics, successfully verifying superior high-frequency transmission characteristics compared to conventional impedance matching structures such as microstrip and stripline. Currently, the development of products utilizing this technology is underway. - "Research on Coaxial Wiring Boards for Ultra-High-Speed Signals" - Joint development with the Electronics Research Division of the National Institute of Advanced Industrial Science and Technology (AIST), High-Density SI Group - Small and Medium Enterprise Agency, FY 2001 Technology Innovation Promotion Project - Received the Excellent Award at the 12th Small and Medium Enterprises New Technology Award - Through a liquid delivery system based on the theory of electric permeation flow in microchannels, we have developed a microplant chip that does not require external liquid delivery equipment and successfully separated proteins as a practical example. Currently, we are advancing research and development of surrounding technologies in line with the expected expansion of the analysis chip market. - "Development of Next-Generation IT Biochemical Chips - Proteome Analysis" - Joint development with the Department of Physics, Faculty of Science, Kitasato University - Japan Science and Technology Agency (JST) FY 2003 Results Development Program B (Creative Modeling)
Company information
TSS Corporation has been pursuing heat management substrate technology for over twenty years, counting from its predecessor company. Furthermore, we have incorporated element technologies such as product development technology, thermal design, and evaluation technology to create a unique business model. We have achieved remarkable results, particularly in the growing fields of LED-related and power electronics-related sectors. TSS aims to be the top brand in heat management substrates through our unique technology, and we aspire to continue growing together with our customers while contributing to the growth of the electronics industry in our country.