Composite processing utilizing machining centers, lathes, grinding, and wire.
By fully equipping our company with machining centers, lathes, grinding machines, and wire processing, we are able to respond to short delivery times. We can provide consistent support from material procurement to plating and post-hardening processing, regardless of the material type.
Inquire About This Product
basic information
We will respond to difficult processing with the technology we have cultivated over many years.
Price information
The price varies depending on the content, so please contact us.
Delivery Time
※Available for immediate response.
Applications/Examples of results
Manufacturing various parts ranging from high-precision components for semiconductor devices to those for automobiles and aircraft.
Company information
1. Non-thermal ultra-fine processing of glass and ceramics using femtosecond lasers is possible. 2. We are fully equipped with in-house 5-axis machining centers, lathes, polishing, and wire processing, enabling complex machining. 3. Prototyping of prisms and light guide plates, as well as mold manufacturing. 4. Short delivery times are possible (if materials are in stock, immediate processing and same-day delivery can be arranged). 5. Processing is possible regardless of material (broadly accommodating materials from resin to hardened steel, titanium, and difficult-to-machine materials like nickel). 6. By providing consistent support from design and assembly to secondary processing such as plating and heat treatment, we are pleased to allow designers and engineers to freely design without worrying about the processing steps.
![[Processing Example] Cooler Unit](https://image.mono.ipros.com/public/product/image/8da/2001231726/IPROS5503074919494448145.png?w=280&h=280)
![[P-725.xCDE2 Focus Scanner for Semiconductor Inspection]](https://image.mono.ipros.com/public/product/image/311014/IPROS2225170907227216833.jpeg?w=280&h=280)