Cross-edge microfabrication [silicon products]

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last updated：Apr 11, 2017

テクニスコ

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Material purity of 99.999999999% or higher! Impurity contamination management is implemented with dedicated silicon equipment.

We use a material with the same thermal expansion rate as silicon wafers to reduce slip occurrence on the wafers.

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basic information

【Features】 ○ Implementation of impurity contamination management with dedicated silicon equipment ○ Slip-free Adopts materials with the same thermal expansion rate as silicon wafers to reduce slip occurrence on wafers ○ Reduced running costs due to improved durability Excellent heat resistance enhances durability against thermal deformation ○ Cleaning quality management Contamination management is conducted in a silicon-dedicated clean room to reduce contamination and particles ○ Mirror finish processing available on the bottom surface of the recess Achieves uniform temperature distribution during semiconductor wafer heat treatment, improving quality variation ○ Custom shape and size options available ● For other functions and details, please download the catalog or contact us.

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Applications/Examples of results

【Applications】 ○ Optical waveguide wafer jig ○ EP tray ○ Inner wall plates of implant domes and various tables ○ CVD susceptor and rings, etc. ● For more details, please contact us.