Flexible printed circuit board
Flexible printed circuit boards (FPC) using liquid crystal polymer (LCP) as an insulating material. Excellent high-frequency characteristics and dimensional stability, achieving precise characteristic impedance matching in FPC. ● Achieving Gbps-level high-speed transmission By adopting LCP as the insulating substrate, it offers a flat low dielectric constant, low dielectric loss tangent, and low moisture absorption across a wide frequency range, resulting in low transmission loss and high dimensional stability. Achieving Gbps-level high-speed transmission. ● Achieving low EMI Low EMI is realized through precise characteristic impedance matching enabled by fine pattern formation technology and high dimensional stability. ● Adoption of the "Bump Build-Up Method" By using conductive bumps as interlayer connection materials in the "Bump Build-Up Method," drilling and plating processes are unnecessary, achieving cost reduction and precise characteristic impedance matching. ● Use of halogen-free materials Adoption of halogen-free materials with consideration for environmental conservation. ● Expansion into various applications Excellent flexibility allows for secondary processing such as bending and electronic component mounting. Proven performance as high-speed differential transmission standard cables such as LVDS, HDMI, and PCI Express.
Inquire About This Product
basic information
Flexible printed circuit boards (FPC) using liquid crystal polymer (LCP) as an insulating material. Excellent high-frequency characteristics and dimensional stability, achieving precise characteristic impedance matching in FPC. ● Achieving Gbps-level high-speed transmission By adopting LCP as the insulating substrate, it offers a flat low dielectric constant, low dielectric loss tangent, and low moisture absorption across a wide frequency range, resulting in low transmission loss and high dimensional stability. Achieving Gbps-level high-speed transmission. ● Achieving low EMI Low EMI is realized through precise characteristic impedance matching enabled by fine patterning technology and high dimensional stability. ● Adoption of "Bump Build-Up Method" By using conductive bumps as interlayer connection materials in the "Bump Build-Up Method," drilling and plating processes are unnecessary. This achieves cost reduction and precise characteristic impedance matching. ● Use of halogen-free materials Adoption of halogen-free materials with consideration for environmental conservation. ● Expansion into various applications Excellent flexibility allows for secondary processing such as bending and electronic component mounting. Proven track record as high-speed differential transmission standard cables such as LVDS, HDMI, and PCI Express.
Price information
-
Delivery Time
Applications/Examples of results
For more details, please contact us.
Company information
We provide a wide range of one-stop support from prototype to mass production of devices and products in collaboration with manufacturers, suppliers, and partner factories. *Proposal, Procurement, Delivery We collaborate with various manufacturers and suppliers to propose and procure electronic components and units that best match your needs, ensuring quick delivery to assist our customers. *Collaboration, Cost, Outsourcing We respond to diverse needs such as board, cable, and unit assembly. We excel in technological innovation and cost reduction. *Earth, Environment, Future As a company, we fulfill our social responsibility to ensure a sustainable future for the global environment.