Flexible printed circuit board
Flexible printed circuit boards (FPC) using liquid crystal polymer (LCP) as an insulating material. Excellent high-frequency characteristics and dimensional stability, achieving precise characteristic impedance matching in FPC. ● Achieving Gbps-level high-speed transmission By adopting LCP as the insulating substrate, it offers a flat low dielectric constant, low dielectric loss tangent, and low moisture absorption across a wide frequency range, resulting in low transmission loss and high dimensional stability. Achieving Gbps-level high-speed transmission. ● Achieving low EMI Low EMI is realized through precise characteristic impedance matching enabled by fine pattern formation technology and high dimensional stability. ● Adoption of the "Bump Build-Up Method" By using conductive bumps as interlayer connection materials in the "Bump Build-Up Method," drilling and plating processes are unnecessary, achieving cost reduction and precise characteristic impedance matching. ● Use of halogen-free materials Adoption of halogen-free materials with consideration for environmental conservation. ● Expansion into various applications Excellent flexibility allows for secondary processing such as bending and electronic component mounting. Proven performance as high-speed differential transmission standard cables such as LVDS, HDMI, and PCI Express.
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Flexible printed circuit boards (FPC) using liquid crystal polymer (LCP) as an insulating material. Excellent high-frequency characteristics and dimensional stability, achieving precise characteristic impedance matching in FPC. ● Achieving Gbps-level high-speed transmission By adopting LCP as the insulating substrate, it offers a flat low dielectric constant, low dielectric loss tangent, and low moisture absorption across a wide frequency range, resulting in low transmission loss and high dimensional stability. Achieving Gbps-level high-speed transmission. ● Achieving low EMI Low EMI is realized through precise characteristic impedance matching enabled by fine patterning technology and high dimensional stability. ● Adoption of "Bump Build-Up Method" By using conductive bumps as interlayer connection materials in the "Bump Build-Up Method," drilling and plating processes are unnecessary. This achieves cost reduction and precise characteristic impedance matching. ● Use of halogen-free materials Adoption of halogen-free materials with consideration for environmental conservation. ● Expansion into various applications Excellent flexibility allows for secondary processing such as bending and electronic component mounting. Proven track record as high-speed differential transmission standard cables such as LVDS, HDMI, and PCI Express.
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We provide a wide range of one-stop support from prototype to mass production of devices and products in collaboration with manufacturers, suppliers, and partner factories. *Proposal, Procurement, Delivery We collaborate with various manufacturers and suppliers to propose and procure electronic components and units that best match your needs, ensuring quick delivery to assist our customers. *Collaboration, Cost, Outsourcing We respond to diverse needs such as board, cable, and unit assembly. We excel in technological innovation and cost reduction. *Earth, Environment, Future As a company, we fulfill our social responsibility to ensure a sustainable future for the global environment.
