We select suitable materials and processes according to the customer's specifications! We can also accommodate small-scale fine pattern processing!
[Features] We accommodate requests from single-process to one-stop solutions. - Substrate arrangement ... Supports a wide variety of materials - Film formation ... Well-equipped for material preparation including sputtering, evaporation, CVD, and plating - Ion implantation ... Capable of over 60 types of materials - Lithography ... Supports contact aligners, steppers, EB lithography, and nanoimprint - Etching ... Supports dry, wet, and sacrificial layer etching - CMP ... Proposes matching CMP processes from slurries - Wafer bonding ... Supports room temperature, anodic, diffusion, and reaction bonding - Dicing ... Compatible with glass, ceramics, and resins
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At Kyodo International, we select suitable materials and processes according to your specifications, accommodating MEMS prototypes and microchips from small quantities. 【Features】 ○ Substrate arrangement We support a variety of materials such as silicon, glass, and resin. ○ Film formation We have over 120 types of materials available for sputtering, evaporation, CVD, plating, etc., enabling speedy responses. ○ Lithography Using contact aligners, steppers, EB lithography, and nanoimprint for 3D patterns. ○ Etching Dry (RIE, ICP), wet, and sacrificial layer etching. ○ CMP We propose CMP processes that match MEMS materials and structures, starting from the composition level of the slurry. ○ Wafer bonding Surface activation, hybrid, anodic, and eutectic bonding. ● For other functions and details, please download the catalog.
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A company that can respond instantly to the rapidly changing information society, that is Kyodo International. It has been 50 years since the company was founded. And a new challenge! We will face difficulties more strongly and boldly than ever. We look forward to your continued support.