A method to secure the heat sink and board with push pins, using the tension of a spring to hold the heat sink in place.
We provide a total solution that includes push pins, springs, and thermal interfaces, fixing the heat sink to the board with push pins and holding the heat sink with the tension of the spring, according to your specifications.
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basic information
- In applications such as mounting on BGA chips, it is possible to press down with an appropriate load using springs without generating tensile stress in the solder joint between the board and the IC during vibration. - A heat sink that can use high-performance thermal grease or phase change materials. - The heat sink can be easily attached and detached during maintenance. == For more details, visit our website ==
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*For detailed specifications and performance data, please visit our website.*
Company information
Alpha Corporation was established in 1972 and has been continuously producing cold-forged components in a wide range of fields, including electrical and transportation equipment. Throughout this process, we have consistently focused on the development of innovative technologies and products based on new concepts, receiving high praise from various sectors. The technology related to heat sinks that we have been developing since 1989 has made it possible to manufacture high-performance heat dissipation devices that were previously considered impossible to produce, while also evolving into a new technology called "Micro Forging" (PAT) that transcends traditional forging concepts. We are confident that our products and technologies will contribute to the development of various industries that will shape the future.
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