The method of securing the heat sink and board with shoulder screws holds the heat sink in place using the tension of the spring.
We provide a method to secure the heat sink and board with shoulder screws, holding the heat sink in place with the tension of the spring. Depending on your specifications, we can offer a total solution that includes shoulder screws, springs, and thermal interfaces.
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basic information
- In applications such as mounting to BGA chips, it is possible to press down with the appropriate load using springs without generating tensile stress in the solder joint between the board and the IC during vibration. - A heat sink that can use high-performance thermal grease or phase change materials. - The heat sink can be easily attached and detached. == For more details, visit our website ==
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*For detailed specifications and performance data, please visit our website.*
Company information
Alpha Corporation was established in 1972 and has been continuously producing cold-forged components in a wide range of fields, including electrical and transportation equipment. Throughout this process, we have consistently focused on the development of innovative technologies and products based on new concepts, receiving high praise from various sectors. The technology related to heat sinks that we have been developing since 1989 has made it possible to manufacture high-performance heat dissipation devices that were previously considered impossible to produce, while also evolving into a new technology called "Micro Forging" (PAT) that transcends traditional forging concepts. We are confident that our products and technologies will contribute to the development of various industries that will shape the future.