Porous resin bond DIA/CBN wheel
In improving the resin bond DIA and CBN wheels so far, we have responded to various grinding needs through enhancements in abrasive materials, bonds, fillers, and concentration levels. However, we have still received strong expectations, requests, and challenges from our customers regarding the handling of difficult-to-grind materials, requirements for precision, efficiency, surface quality improvements, and cost reductions. To address these challenges, we have successfully developed and completed a new yet old technology: the porous wheel.
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basic information
【Features】 ○ Low grinding resistance due to pores ○ Extended dressing intervals ○ Improved grinding sound ○ Effective for machining difficult-to-cut materials and compatible with various grinding and polishing ○ High design flexibility ○ Sustains sharpness ○ Effective chip discharge and heat dissipation ● For more details, please contact us or download the catalog.
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Applications/Examples of results
High-efficiency grinding High-precision grinding Mirror surface processing Ceramics grinding Tool grinding, etc. ● For more details, please contact us or download the catalog.
Company information
Since its founding in 1936, Teiken has been engaged in the manufacturing and sales of grinding wheels. Leveraging 80 years of know-how, each grinding wheel we produce has its own unique characteristics, but in recent years, we have particularly focused on "porosity." Even when using similar abrasives and bonds, we can dramatically improve the performance of the wheels by controlling the size and quantity of the pores in various styles. Thanks to this porosity technology, we have several top-share products in niche areas within the domestic market. We invite you to give them a try.
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