Conducting various reliability tests increases safety and certainty.
For the manufactured printed circuit boards, it is possible to conduct the reliability tests listed below.
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basic information
【Features】 〇 For the manufactured printed circuit boards, various reliability tests listed below can be conducted. 〇 Solder heat resistance test (260°C, 288°C, etc.) 〇 Peel strength test (copper foil peel-off strength test) 〇 Cycle test (thermal cycle test in a climate chamber) 〇 Temperature and humidity cycle test 〇 Cross-sectional observation microsection (cross-sectional observation at magnifications of 25/50/100/200/400/1000 times is possible.) 〇 Chemical resistance test (acid and alkali) 〇 Water absorption measurement ● For other functions and details, please contact us.
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Applications/Examples of results
【Applications】 〇 Printed circuit boards (multilayer boards, BGA/CSP high-density boards, flat through-holes, aluminum boards, and other special wiring boards for consumer and industrial use prototype manufacturing) 〇 Laser drawing, CAM editing, precision industrial photography, complete screen printing ● For other functions and details, please contact us.
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The screen process strives to meet various customer needs by pursuing high quality, high precision, and short delivery times, while also accurately responding to the demand for lower prices. Furthermore, we aim to deliver products that anticipate future directions and contribute to a prosperous future.