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  5. Processing Contract
  6. Precision machining of hard and brittle materials and deep hole processing

Precision machining of hard and brittle materials and deep hole processing

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last updated:Mar 04, 2022

フジ・グラインド 横須賀試作場
フジ・グラインド 横須賀試作場
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Experience in machining deep holes over 1 meter. Manufacturing of dedicated processing machines and supply of diamond tools is also available.

We are engaged in the machining of hard and brittle materials, such as precision parts used in semiconductor manufacturing processes and parts for analytical instruments. Additionally, we have extensive experience as a manufacturer of specialized processing machines that incorporate our machining know-how, including: - Deep hole machining machines for hard and brittle materials - Constant pressure grinding machines for shape processing - Ceramic processing machines that utilize electrolytic dressing - W-core processing machines that can simultaneously extract inner and outer diameters We have developed a wide range of specialized machines and have received high praise for our work. Please feel free to contact us for more information. *For details, please download the PDF materials or feel free to reach out to us. *Our company brochure also includes information on our machining achievements.

    Processing Contract
buhin05.jpg

Precision machining of hard and brittle materials and deep hole processing

buhin05.jpg
buhin05.jpg

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basic information

As a contract processing business, we handle precision parts for semiconductor manufacturing processes and parts for analytical instruments. We process components made from hard and brittle materials such as ceramics, quartz glass, and semiconductor silicon. In our dedicated machine manufacturing business, we develop and sell specialized grinding machines, polishing machines, measuring machines, and assembly machines for hard and brittle materials. In addition, we design and sell specialized diamond tools. Our main clients include manufacturers of quartz and silicon materials, manufacturers related to optical cables, and various manufacturers involved in semiconductor technology development.

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Applications/Examples of results

Manufacturer of semiconductor-related components. Manufacturer of components for analyzers. Manufacturer of optical components. We specialize in precision grinding of hard and brittle materials and offer contract machining services. We excel in high-difficulty machining such as through-hole processing of φ2.0×500L and precision 5-sided machining, and we can also provide suggestions on shapes and processes for development products and other inquiries.

Detailed information

  • 100909_2309591.jpg

    An example of precision grinding processing, it is an outer cylindrical grinding product. It is about the length of a matchstick.

  • grinds02.jpg

    Sales of tools for deep hole machining are also possible.

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Tool Sharpness Detection Fixture for Grinding Processing

Tool Sharpness Detection Fixture for Grinding Processing

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Company brochure with processing examples

Company brochure with processing examples

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Fuji Grind Co., Ltd. Company Profile

Fuji Grind Co., Ltd. Company Profile

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Company information

フジ・グラインド

フジ・グラインド 横須賀試作場

Manufacturing and processing contract

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As a machinery manufacturer, - We propose processing machines with advantages by devising construction methods or tools and confirming them through demonstration tests. Our developed processing machines have received high evaluations in manufacturing sites for automotive parts, optical components, semiconductor-related products, and optical communication-related products. - If necessary, we also provide consulting on dedicated diamond tool proposals, prototyping, sales, and process layout. - Starting this year, 2017, we will begin selling jigs that can detect the sharpness of tools. As a parts processing manufacturer, - We accept orders from prototyping of high-difficulty parts to medium-volume production. - For mass production, separate discussions will be required. - Please contact us for shape processing that cannot be done by other companies, precision flat processing, cost reduction considerations, etc. - Currently, we are producing parts used in semiconductor manufacturing equipment, medical devices, analyzers, and more.

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