Precision machining of hard and brittle materials and deep hole processing

basic information

As a contract processing business, we handle precision parts for semiconductor manufacturing processes and parts for analytical instruments. We process components made from hard and brittle materials such as ceramics, quartz glass, and semiconductor silicon. In our dedicated machine manufacturing business, we develop and sell specialized grinding machines, polishing machines, measuring machines, and assembly machines for hard and brittle materials. In addition, we design and sell specialized diamond tools. Our main clients include manufacturers of quartz and silicon materials, manufacturers related to optical cables, and various manufacturers involved in semiconductor technology development.

Price information

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Delivery Time

Applications/Examples of results

Manufacturer of semiconductor-related components. Manufacturer of components for analyzers. Manufacturer of optical components. We specialize in precision grinding of hard and brittle materials and offer contract machining services. We excel in high-difficulty machining such as through-hole processing of φ2.0×500L and precision 5-sided machining, and we can also provide suggestions on shapes and processes for development products and other inquiries.

Detailed information

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  An example of precision grinding processing, it is an outer cylindrical grinding product. It is about the length of a matchstick.

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  Sales of tools for deep hole machining are also possible.