A T-die that eliminates resin leakage, which has been a problem in the extrusion lamination process, and minimizes the amount of resin during purging to the necessary minimum (one-third of the conventional amount).
- The purge amount during resin change and film width change is one-third of the conventional amount. - During film width change, complete prevention of resin leakage from the non-extruded section. - Lip single unit precision using in-house processing technology > Surface roughness: Ra0.04μm Edge part: R50μm or less Straightness: 5μm/1000mm
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basic information
The newly developed inner nickel structure (PAT.) in the extrusion film forming device solves all the issues of conventional machines! It achieves reduced production loss and cost savings.
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Applications/Examples of results
Most of the product packaging displayed in convenience stores uses film that has been produced by our machines.
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In addition to the design and manufacturing of our proprietary patent for T-dies used in extruded films, we focus on the production of coating dies used in various applications such as liquid crystal, optics, and electronic components. Based on the manufacturing process, we invite you to utilize our technologies, including ultra-precision flat grinding and precision mirror finishing.