High-performance CPU board OYO104 equipped with popular CPU SuperH (SH-3 + DSP)
OYO104 is a CPU board that compactly integrates a high-performance CPU (SH-3 + DSP) and the necessary surrounding functions (100mm × 80mm). * Equipped with a high-performance RISC module chip (HJ93D2010BP) * High-speed operation with CPU clock at 133MHz and SDRAM at 66MHz * SDRAM built into the RISC chip module * Eight status LEDs and eight status switches included * Program download to onboard Flash ROM included * Supports debugging via JTAG and AUD ports * Programming development languages (C and assembler) are available for use
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basic information
OYO104 is a CPU board that compactly integrates a high-performance CPU (SH-3 + DSP) and the necessary surrounding functions (100mm x 80mm). * Equipped with a high-performance RISC module chip (HJ93D2010BP) * High-speed operation with a CPU clock of 133MHz and SDRAM at 66MHz * SDRAM built into the RISC chip module * Eight status LED displays and eight status switches included * Comes with a downloadable program to the onboard Flash ROM * Supports debugging via JTAG and AUD ports * Programming development languages (C and assembler) are available for use
Price information
-
Delivery Time
P4
Applications/Examples of results
It can be used for high-speed image processing, robot controllers, and more.
Company information
★ Both electrical design and mechanical design are supported, and the company continues to expand smoothly, with annual sales projected to increase from 9.7 billion yen last year to 12.5 billion yen this year (with the fiscal year ending this month). We have a total of 70 technical staff involved in various software designs such as measurement and control circuit design, image processing, mechatronics line design, and related peripheral designs, and the number of employees has exceeded 540. ★ Not only design but also sheet metal processing, machining, surface mounting, assembly, and inspection are in-house processes, ensuring short delivery times and high quality. In particular, we have equipment capable of handling large boards (500×600) and high-density boards (BGA, 0.5mm QFP) for circuit board assembly, and in the inspection process, we have equipment such as X-ray inspection machines and in-circuit testers. Additionally, we have renewed our equipment mainly at the Kumamoto, Hamamatsu, and Sagamihara factories. ★ In January 2015, we established the Sagamihara Division in addition to the Kyoto, Kumamoto, and Hamamatsu factories, creating a four-division structure, and in March 2016, new buildings began operations at the Kyoto and Kumamoto factories.
