BGA solder ball regeneration can be done quickly and easily.
This is a BGA reballing sheet made of high-temperature resistant polyimide, processed to match the BGA package size, with holes for ball arrangement, and solder balls stored in those holes.
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basic information
After applying flux, simply overlay the BGA onto the preform and heat it in the reflow oven. After reflow, remove the preform and clean with IPA or similar to complete the reballing.
Price information
-
Delivery Time
P4
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Applications/Examples of results
BGA reballing, solder bump regeneration
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Company information
Our company was founded in 1976 in Okaya City, Nagano Prefecture, and since then, we have expanded our export business of machine tools to the Chinese and Southeast Asian markets. Starting in 1997, we began importing, selling, and servicing equipment for the electronics industry. Currently, we are also working on the development of our own products, such as various reflow soldering machines and ultrasonic metal joining devices, to meet market needs.
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