This is a wire that can challenge the limits of bonding technologies such as fine line, long span, and fine pitch.
This wire challenges the limits of bonding technology, such as fine wire, long span, and fine pitch. As a solution provider for bonding wires, our company also assists customers with technical analysis of various issues they face. Additionally, we will respond promptly to customer demands arising from the rapid technological innovations of recent times.
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basic information
This wire challenges the limits of bonding technology, such as fine wire, long span, and fine pitch. As a solution provider for bonding wires, our company also assists customers with technical analysis of various issues. Additionally, we will respond promptly to customer demands arising from the recent rapid technological innovations.
Price information
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Delivery Time
P4
Applications/Examples of results
This is a wire that can challenge the limits of bonding technologies such as fine line, long span, and fine pitch.
Company information
Quality Assurance System: "Comprehensive Quality Assurance System" Service System: "Customer-Centric Technical Service" We have established a system to collaborate with Nippon Steel Corporation and the Advanced Technology Research Institute to develop new standard products and assist in solving technical challenges related to customers' semiconductor packaging. Through a close-knit system, we respond to our customers' needs.
