Final substrate appearance inspection device
NanoHunter Final Circuit Board Appearance Inspection Device
Final substrate appearance inspection device with excellent defect identification capability powered by artificial intelligence.
In the conventional learning method used for final appearance inspection devices, as the number of training samples increases, the number of pseudo-defects decreases, but the defect detection capability drops drastically. Particularly, minute defects near patterns become almost invisible. Our company has successfully developed a new technology that overcomes the shortcomings of such learning methods. This technology changes the weights and connection states of the artificial intelligence parameters for defect detection through learning, allowing for accurate detection of defects near patterns, which were previously considered a drawback of conventional learning methods, while generating almost no pseudo-defects. With the development of this technology, it has become possible to detect defects such as solder mask peeling and excessive solder on solder substrates, which were previously deemed impossible to detect.
Inquire About This Product
basic information
1. Inspection target: Final substrates after resist for solder, gold plating, copper printed circuit boards, COB and other package substrates. 2. Detected defects: Solder edge resist peeling, excessive solder, insufficient solder, dents, protrusions, discoloration, foreign matter, chipping, scratches on the plating area, visible copper, silk defects, cracks, resist pinholes, etc. 3. Resolution: 1μm to 150μm. 4. Tact: High-resolution camera (1280 horizontal × 1024 vertical pixels) processing time per field of view: 0.5 seconds.
Price information
-
Delivery Time
P4
Applications/Examples of results
It is used for the inspection of final substrates after resist application, such as soldered, gold-plated, copper printed circuit boards, and COB package substrates.
Company information
We are engaged in the development and sales of image processing systems, focusing on the "final substrate appearance inspection device" equipped with excellent defect identification capabilities through artificial intelligence, and the "general-purpose image processing software" featuring a unique binarization method that is effective for unclear images and images with density unevenness.
