List of Design and production support products
- classification：Design and production support
3346～3360 item / All 12293 items
Even thin and small samples, as well as samples with high thermal conductivity, can be measured!
- Thermo-fluid analysis
[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'
The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.
Leave the measurement of the thermal conductivity of carbon fiber reinforced plastic (CFRP) to us.
- Thermo-fluid analysis
[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'
The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.
For the efficiency of product design and development! Analyzing mechanical behavior, including deformation of parts due to load, contributes to reducing prototyping costs and shortening development ti...
- Other analyses
SCORG is a measurement software for the design and analysis of screw compressors, expanders, pumps, and motors.
- simulator
- Thermo-fluid analysis
- Contract Analysis
The upgraded hot end allows for quick release and installation in just one minute.
- 3D Printer
Stable performance for 8,000 hours: The thick metal plate and aluminum alloy vertical profile provide stable performance.
- 3D Printer
High-stability cube-shaped frame. It has an orthogonal structure and is reinforced by a silicone bed mount.
- 3D Printer
A design that achieves unparalleled precision and surface finishing.
- 3D Printer
High-precision simulation software recognized by the world.
- simulator
- Solar power generator
- SFA/Sales Support System
Announcement of the Laplace Seminar to be held in January
We invite you to participate in the "Laplace Seminar," a content-rich event that includes a casual Q&A session to introduce our products and solutions. Please join us as a place for information gathering and study. ■ Kyoto Venue <Date and Location> Date: January 24, 2020 (Friday) Venue: Laplace System Co., Ltd. Kyoto Headquarters <Seminar Content> Part 1 (14:30–15:30): Overview of Solar Pro products and new features Part 2 (15:45–16:45): Monitoring and output control, etc. Part 3 (17:00–17:30): Individual consultations
~Press molding simulation software for all tool designers~
- Stress Analysis
The most innovative software for hot/cold forging simulation!
- Other analyses
World's first! Dedicated software developed for extrusion technology simulation and optimization of extrusion die design.
- Thermo-fluid analysis
Equipped with unique dedicated features specialized for ring rolling analysis!
- Structural Analysis