List of Business support services products
- classification：Business support services
6886～6900 item / All 33075 items
For companies facing difficulties when accepting technical intern trainees! We prevent mismatches with strict screening criteria.
- Temporary staffing business
- Recruitment business
We provide one-stop support from recruitment to post-entry follow-up! If you have any questions or concerns regarding the details of the trainees, please contact us.
- Temporary staffing business
- Recruitment business
If you have any issues with accepting technical intern trainees, please leave it to us!
- Recruitment business
- Temporary staffing business
If you have concerns about issues that could clearly interfere with work, such as being hired without being informed of them, please reach out to our company regarding the acceptance of technical inte...
- Recruitment business
- Temporary staffing business
The intern did not meet the requirements in terms of appearance, personality, physique, tattoos, etc.! Please leave any concerns regarding the acceptance of technical interns to our company.
- Temporary staffing business
- Recruitment business
Issues such as pre-existing conditions or special notes that may affect work after entering the country have not been communicated in advance! Vietnam Human Resource Coordination.
- Temporary staffing business
- Recruitment business
We provide one-stop support from hiring quality personnel to follow-up after their entry into the country!
- Temporary staffing business
- Recruitment business
TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and...
- Contract Analysis
- Other semiconductors
- Other contract services
Announcement of the introduction of Talos F200E
Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.
We provide latch-up testing services to evaluate the resistance of CMOS ICs and semiconductor products containing them to latch-up destruction.
- Contract Inspection
- Other contract services
- Other inspection equipment and devices
Evaluate whether there are any potential issues related to characteristics or structure! We propose reliability testing methods and conditions.
- Public Testing/Laboratory
Supports IOL tests and power cycle tests for small discrete semiconductors!
- Public Testing/Laboratory
IOL testing of discrete semiconductors
Our company conducts "IOL testing of discrete semiconductors." We repeatedly turn the power ON/OFF in a room temperature environment, applying stress to the device due to temperature changes caused by the device's own heat generation during power ON. During power OFF (cooling), forced cooling is also performed using a fan. Additionally, before conducting the tests, we use representative samples to make adjustments to reach the test temperature conditions. It is possible to adjust the current/time during heating and the fan capacity/timing during cooling.
We are equipped with a variety of devices to meet your needs, including dimension measurement of various parts and surface roughness measurement!
- Visual Inspection Equipment
- Other measurement, recording and measuring instruments
- Other contract services
Observation of thermal deformation using a 3D shape measuring machine (VR-6200)
This is a measuring device that can non-contact measure surface shapes such as concavities, undulations, and surface roughness. We will introduce "heating deformation observation" using a 3D shape measuring machine. First, we acquire a 3D texture image at room temperature, and then we acquire a 3D texture image in the heated state. By overlaying the texture images before and after heating and checking the differential texture image and cross-sectional profile, it can be seen that the substrate in the heated state has higher ends and a lower center compared to the room temperature state.
Support for the difficulties in the development and evaluation of components, devices, and materials related to semiconductor products.
- Other contract services
Strain measurement of power module package resin.
We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in the mounted state on a circuit board and in the unmounted state. In the mounted module, a slight delay in temperature change was observed, and correspondingly, the change in strain also appeared to be delayed. This is believed to be due to the slower transfer of heat to the module when it is mounted. At Aites, we conduct temperature cycle tests and temperature-humidity cycle tests, during which we can simultaneously measure the strain occurring in the mounted components. Please feel free to consult with us.
By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.
- Contract Analysis
- Other contract services
- Contract measurement
Cryogenic ion milling cross-section processing example (rubber products)
We will introduce a case where cross-sections were created and observed by method regarding the adhesive parts of the tires of pull-back cars. When conducting SEM observations of the created cross-sections, fillers present inside the rubber were confirmed. It was found that the dispersion state of the fillers and the condition of the adhesive interface were not clear with fracture by liquid nitrogen or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for clear observation of the dispersion state of the fillers contained within the rubber and the condition of the adhesive interface with the plastic substrate.
It is possible to observe cross-sections while observing FIB processing in real time.
- Contract Analysis
- Other contract services
- Electron microscope
Power device failure location / Slice & View three-dimensional reconstruction
I will introduce the three-dimensional reconstruction of failure locations using the Slice & View function of FIB-SEM. Continuous SEM images of the structure are obtained, and the resulting images are corrected for positional misalignment between the SEM images and visualized in three dimensions using 3D construction software (Avizo). By combining the position identification technique for cross-sectioning the failure location with the Slice & View function, it is possible to obtain continuous SEM images that retain the defective state and include information before and after the abnormal area.