List of CAE products
- classification：CAE
661～675 item / All 3938 items
For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.
- Work gloves
Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.
Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.
![[Example of Analysis by EBSD] Screw](https://image.mono.ipros.com/public/product/image/d61/2000533368/IPROS90868083247351914914.png?w=280&h=280){kind=small}
We will introduce an example of analysis using EBSD for screws (Cu2Zn).
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
Visualize the features that appear in the graph! You can check the distribution of crystal sizes and the orientation of crystal directions.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
The EBSD method allows for the estimation of crystal states and residual stresses! Here is an example of BGA analysis.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of crystal analysis of intermetallic compounds at solder joints.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of the analysis of EBSD patterns (Kikuchi patterns) at gold wire bond joints.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
By combining various methods suitable for failure modes, we can consistently address everything from the identification of defective nodes to physical analysis.
- Other analyses
- Contract Analysis
- Analysis Services
Pre-processing of SiC devices → Identification of leakage points → Physical analysis/component analysis handled seamlessly!
- Analysis Services
- Contract Analysis
Announcement of the introduction of Talos F200E
Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.
Even with SiC power devices, we can provide consistent support for cross-section preparation of specific areas, observation of diffusion layer shapes, as well as wiring structure and crystal structure...
- Analysis Services
- Contract Analysis
Check the quality status of LCD components and products! We will analyze the structures of the LCD panels using our analytical methods and expertise!
- Analysis Services
- Contract Analysis
Observation of Conductive Particle Shape in COG Implementation
We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) for conductivity is deposited on its surface. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and connection status, cross-sectional observations were conducted, revealing that the particle deformation was at a "medium" level, indicating an appropriate degree of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related defects.
We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis regarding the malfunctioning part!
- Analysis Services
- Contract Analysis
- Semiconductor inspection/test equipment
Announcement of the introduction of Talos F200E
Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.
![[Data] Research Institute of Chemic...](https://image.mono.ipros.com/public/product/image/3b2/2000541783/IPROS94910342422717202563.png?w=280&h=280){kind=small}
Clear publication of analysis results using polyamide imide materials and IR devices, as well as data analysis!
- Analysis Services
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Analysis of inorganic compounds such as metal oxides is also possible!
- Analysis Services
- Contract Analysis
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Examples of analysis using EBSD, such as 'Observation/Elemental Analysis' and 'Analysis by EBSD'!
- Contract Analysis
- Analysis Services
Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.
- Contract Analysis
- Analysis Services
Examples of semiconductor observation using mechanical polishing.
In the methods for cross-section preparation in semiconductor structure observation and defect analysis, CP, FIB, and mechanical polishing are mentioned, each having its own advantages and disadvantages, making it necessary to consider which method to use. In recent years, CP and FIB have become more common, and it seems that the use of mechanically polished methods, which require technical skill, is decreasing. However, it is still not something to be dismissed. While there are merits and demerits, it is possible to achieve cross-section preparation with mechanical polishing that is on par with FIB and CP. At our company, based on years of accumulated know-how, we propose the most appropriate processing method according to the observation purpose, sample composition, and structure.