List of Embedded Systems products
- classification：Embedded Systems
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![CPU module "SMARC" [LEC-iMX6]](https://image.mono.ipros.com/public/product/image/75c/2000219877/IPROS5079826362096052175.jpg?w=280&h=280){kind=small}
NXP/i.MX6 equipped SMARC short-size module
- Embedded Board Computers
The newly released SMARC module specification revision 2.1 will be the first open AIoM (AI on Module) specification.
ADLINK Technology, one of the main contributors to the SMARC SGET committee, has announced the release of the SMARC module revision 2.1. The SGET (Standardization Group for Embedded Technologies) has just introduced the latest future-proof specification 2.1. The new features are only additional items that do not affect the multiplexing of existing signals and the pins of the edge connector assigned in the 2.0 specification, making the specification fully backward compatible with the current specification 2.0. The main additions are as follows: - Anticipating the needs of the AI and robotics markets, support for up to four MIPI CSI ports - Expansion of Ethernet ports through multiplexing of SERDES signals on the third and fourth PCIe x1 interfaces - Various minor additions for initially unused pins such as plus 2 GPIO pins and PCIe clock request signals
Compact size COM Express Type 6 module equipped with Pentium and Celeron.
- Embedded Board Computers
Released IoT solutions for mobility, healthcare, and industrial automation equipped with Intel Atom x5-E8000 processors.
The release of four embedded computing solutions featuring the Intel Atom x5-E8000 processor has been announced. The Intel Atom processor, built on 14 nm technology, helps improve performance for mobility, medical, and industrial automation applications while reducing power consumption. The latest COM Express cExpress-BW, SMARC LEC-BW, Qseven Q7-BW modules, and the K's AmITX-BW-I Mini-ITX embedded board have been enhanced in computational performance, allowing for a better price/performance ratio.
Mini ITX embedded board equipped with Intel Atom E3900 series, Pentium, and Celeron SoC.
- Embedded Board Computers
Value Family 9th Generation Intel Core i7/i5/i3, 8th Generation Celeron Processor Equipped Embedded Fanless Computer
- Industrial PCs
- Embedded Board Computers
ADLINK accelerates the adoption of edge AI and computing with next-generation Matrix embedded computers.
ADLINK Technology today announced the release of the next-generation Matrix embedded computer, designed to enhance the responsiveness and durability of edge AI and computing applications. The next-generation Matrix series, engineered to boost performance, offers innovation and robustness to enable data-driven decision-making at the edge, achieving improvements in efficiency, productivity, and security across the industry. The next-generation Matrix series elevates system responsiveness to the next level with its heterogeneous computing architecture. The new Matrix series combines CPU computing based on the 9th generation Intel Xeon and Core processors with GPU computing from the NVIDIA Quadro Embedded GPU, accelerating compute-intensive high-resolution medical imaging and enabling faster and more accurate diagnoses.
Value Family 9th Generation Intel Xeon/Core i7/i5/i3 and 8th Generation Celeron Equipped Expandable Computer
- Industrial PCs
- Embedded Board Computers
ADLINK accelerates the adoption of edge AI and computing with next-generation Matrix embedded computers.
ADLINK Technology today announced the release of the next-generation Matrix embedded computer, designed to enhance the responsiveness and durability of edge AI and computing applications. The next-generation Matrix series, engineered to boost performance, offers innovation and robustness to enable data-driven decision-making at the edge, achieving improvements in efficiency, productivity, and security across the industry. The next-generation Matrix series elevates system responsiveness to the next level with its heterogeneous computing architecture. The new Matrix series combines CPU computing based on the 9th generation Intel Xeon and Core processors with GPU computing from the NVIDIA Quadro Embedded GPU, accelerating compute-intensive high-resolution medical imaging and enabling faster and more accurate diagnoses.
![CPU module "SMARC" [LEC-IMX8MP]](https://image.mono.ipros.com/public/product/image/79b/2000598940/IPROS31315477312969060387.jpeg?w=280&h=280){kind=small}
NXP i.MX 8MPlus equipped SMARC short-size module
- Embedded Board Computers
Accelerating secure IoT design with ADLINK's SoM and Atmark Techno Linux.
ADLINK Technology, a global leader in edge computing, has announced support for the Linux-based "Armadillo Base OS" (ABOS), developed by Atmark Techno and optimized for ADLINK's system-on-module (SoM). By combining ADLINK's high-density SoM with ABOS's embedded security features and long-term maintenance capabilities, IoT manufacturers can reduce development costs and shorten the time to market for secure IoT devices. Advancements in semiconductor technology have improved the performance of system-on-chip (SoC) devices, while also increasing the complexity of circuit board design. ADLINK's SoM integrates the processor, memory (including high-speed LPDDR4X/LPDDR5), and peripheral interfaces into a single module, simplifying carrier board design and reducing development effort.
Rugged 3U VPX processor blade equipped with 11th generation Intel Core i7, compliant with SOSA.
- Embedded Board Computers
ADLINK has formed a strategic partnership with Pixus Technologies to develop a highly integrated SOSA-compliant OpenVPX system solution for aerospace and defense applications.
●This strategic partnership leverages ADLINK's over 20 years of experience in robust embedded computing for mission-critical applications and Pixus's deep expertise in military-standard compliant designs for system backplanes and chassis platforms. ●Both companies will jointly develop a Proof of Concept (PoC) demo of OpenVPX compliant with SOSA and collaborate with global system integrators to develop advanced C4ISR applications. ●ADLINK's SOSA-compliant OpenVPX building blocks include the industry's first 3U VPX blade "VPX3-TL" equipped with an Intel Tiger Lake processor.
NVIDIA RTX A2000 built-in mobile PCI Express module
- Embedded Board Computers
ADLINK releases the first embedded MXM graphics module featuring the NVIDIA Ampere architecture for edge computing and AI.
● ADLINK's EGX-MXM-A1000, EGX-MXM-A2000, and EGX-MXM-A4500 are the first modules to adopt NVIDIA's embedded GPU based on the NVIDIA Ampere architecture. ● ADLINK's MXM graphics modules provide high-performance GPU acceleration in a compact and power-efficient MXM form factor, bringing edge computing and embedded AI to many vertical markets such as healthcare, manufacturing, and transportation. ● Robust design that withstands harsh temperature environments, shock, vibration, and corrosion under severe conditions.
NVIDIA RTX A4500 built-in mobile PCI Express module
- Embedded Board Computers
ADLINK releases the first embedded MXM graphics module featuring the NVIDIA Ampere architecture for edge computing and AI.
● ADLINK's EGX-MXM-A1000, EGX-MXM-A2000, and EGX-MXM-A4500 are the first modules to adopt NVIDIA's embedded GPU based on the NVIDIA Ampere architecture. ● ADLINK's MXM graphics modules provide high-performance GPU acceleration in a compact and power-efficient MXM form factor, bringing edge computing and embedded AI to many vertical markets such as healthcare, manufacturing, and transportation. ● Robust design that withstands harsh temperature environments, shock, vibration, and corrosion under severe conditions.
Value Family 12th Generation Intel Processor Equipped Embedded Expandable Computer
- Industrial PCs
- Embedded Board Computers
ADLINK's next-generation IPC will revolutionize industrial use cases at the edge with its scalable design and custom function modules.
●Unmatched Performance: Equipped with 12th/13th generation Intel Core i9/i7/i5/i3 processors, achieving class-leading performance. ●Ultimate Flexibility: Modular and scalable design that is easy to expand, with optional FM modules to meet domain-specific requirements. ●AI-Ready Edge Platform: With built-in GPU power and machine vision capabilities, the ADLINK MVP-5200/6200 can instantly deploy AI-enabled applications.
Mini-ITX embedded board equipped with 12th/13th/14th generation Intel Core desktop processors.
- Embedded Board Computers
3.5-inch single-board computer equipped with Intel N97 processor
- Embedded Board Computers
ADLINK releases a new 3.5-inch single-board computer for scalable edge AI and robust embedded applications.
●3.5 "Expanding the SBC Portfolio: ADLINK has announced the SBC35-MTL and SBC35-ASL, targeting both high-performance AI and robust embedded edge applications. ●AI Compatibility and Robust Design: The SBC35-MTL is equipped with an Intel Core Ultra featuring an NPU for real-time inference, while the SBC35-ASL is powered by the Intel Atom x7000RE, providing a wide temperature range and fanless operation. ●Flexible I/O with SBC-FM Modules: Both models support ADLINK's SBC-FM expansion modules, enabling customized I/O to accelerate deployment across various industries.
![CPU module "SMARC" [LEC-IMX95]](https://image.mono.ipros.com/public/product/image/0c2/2001482197/IPROS41015035827848460144.png?w=280&h=280){kind=small}
NXP i.MX95 equipped SMARC 2.1 short-size module
- Embedded Board Computers
ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!
This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution
OSM R1.1 Size L module equipped with MediaTek Genio 510 series processor.
- Embedded Board Computers
ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!
This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution
Mini type COM-HPC module equipped with Intel Core Ultra processor (Meteor Lake)
- Embedded Board Computers
ADLINK releases Intel Core Ultra COM-HPC Mini with powerful computing performance in a 95mm x 70mm form factor.
- Equipped with the Intel Core Ultra architecture featuring up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, offering both ultra power and energy efficiency. - 64GB of LPDDR5x memory is directly soldered onto the board, supporting maximum performance in a 95 x 70mm form factor, with an operating temperature range of -40°C to 85°C. - Integrated with up to 16 PCIe lanes, two SATA interfaces, two 2.5GbE Ethernet ports, and multiple DDI/USB4 and USB 3.0/2.0 interfaces for abundant I/O options.
12th/13th/14th generation Intel Core i3/i5/i7/i9 equipped integrated embedded computer
- Industrial PCs
- Embedded Board Computers
Expandable embedded computer equipped with 12th/13th/14th generation Intel Core i3/i5/i7/i9.
- Industrial PCs
- Embedded Board Computers
NVIDIA RTX ADA 2000 built-in MXM GPU module
- Embedded Board Computers
NVIDIA RTX ADA 3500 built-in MXM GPU module
- Embedded Board Computers
3.5-inch single-board computer equipped with Intel Core Ultra processor
- Embedded Board Computers
ADLINK releases a new 3.5-inch single-board computer for scalable edge AI and robust embedded applications.
●3.5 "Expanding the SBC Portfolio: ADLINK has announced the SBC35-MTL and SBC35-ASL, targeting both high-performance AI and robust embedded edge applications. ●AI Compatibility and Robust Design: The SBC35-MTL is equipped with an Intel Core Ultra featuring an NPU for real-time inference, while the SBC35-ASL is powered by the Intel Atom x7000RE, providing a wide temperature range and fanless operation. ●Flexible I/O with SBC-FM Modules: Both models support ADLINK's SBC-FM expansion modules, enabling customized I/O to accelerate deployment across various industries.
3.5-inch single board computer equipped with Intel x7835RE/x7433RE/x7211RE processors
- Embedded Board Computers
ADLINK releases a new 3.5-inch single-board computer for scalable edge AI and robust embedded applications.
●3.5 "Expanding the SBC Portfolio: ADLINK has announced the SBC35-MTL and SBC35-ASL, targeting both high-performance AI and robust embedded edge applications. ●AI Compatibility and Robust Design: The SBC35-MTL is equipped with an Intel Core Ultra featuring an NPU for real-time inference, while the SBC35-ASL is powered by the Intel Atom x7000RE, providing a wide temperature range and fanless operation. ●Flexible I/O with SBC-FM Modules: Both models support ADLINK's SBC-FM expansion modules, enabling customized I/O to accelerate deployment across various industries.
Wide voltage Mini-ITX supporting H610 chipset and 14th/13th/12th generation Intel Core CPUs.
- Embedded Board Computers
ADLINK releases wide voltage compatible Mini-ITX motherboards for industrial embedded applications.
●Wide voltage input: Supports 12-28V DC input, ensuring stable operation even in environments with unstable power. ●Balanced performance: Supports Intel Core CPUs with a maximum of 65W using PCIe 4.0, DDR4, and dual 2.5GbE. ●Ideal design for industrial applications: The Mini-ITX form factor and rich expandability enable seamless integration into embedded systems.
Qualcomm QRB5165 Series Octa-Core SoC Equipped SMARC Short Size Module
- Embedded Board Computers
SMARC short-size module equipped with NXP i.MX 8M Mini SoC
- Embedded Board Computers
Mini type COM-HPC module equipped with Intel Core Ultra processor (Meteor Lake)
- Embedded Board Computers
Qualcomm QRB5165 Series Octa-Core SoC Equipped SMARC Short Size Module
- Embedded Board Computers
OSM R1.1 Size L module equipped with MediaTek Genio 510 series processor.
- Embedded Board Computers
Autonomous Driving AI Decision-Making Controller (ECU)
- Embedded Board Computers
ADLINK's 7 products won the 2026 Taiwan Excellence Award, showcasing outstanding research and development innovation leadership.
●ADLINK wins 7 products at the 34th Taiwan Excellence Awards: This demonstrates the company's advanced research and development capabilities in edge AI computing and intelligent applications. The award-winning products span industrial computers, AI platforms, and medical and transportation solutions, showcasing the company's comprehensive innovation strength. ●AI drives smart industries and accelerates modular innovation: Products such as the EMP-520, SP2-MTL, and Ampere Altra Dev Kit leverage high-performance AI inference and modular design to help companies expedite the adoption of smart manufacturing and automation applications. ●New milestones in smart transportation and medical applications: The ADM-AL30, AVA series, and MLC-S medical panel PC provide highly stable AI computing and robust security protection in autonomous driving, railways, and clinical medical environments, realizing a reliable intelligent ecosystem.
Scalable T2G onboard gateway
- Embedded Board Computers
ADLINK's 7 products won the 2026 Taiwan Excellence Award, showcasing outstanding research and development innovation leadership.
●ADLINK wins 7 products at the 34th Taiwan Excellence Awards: This demonstrates the company's advanced research and development capabilities in edge AI computing and intelligent applications. The award-winning products span industrial computers, AI platforms, and medical and transportation solutions, showcasing the company's comprehensive innovation strength. ●AI drives smart industries and accelerates modular innovation: Products such as the EMP-520, SP2-MTL, and Ampere Altra Dev Kit leverage high-performance AI inference and modular design to help companies expedite the adoption of smart manufacturing and automation applications. ●New milestones in smart transportation and medical applications: The ADM-AL30, AVA series, and MLC-S medical panel PC provide highly stable AI computing and robust security protection in autonomous driving, railways, and clinical medical environments, realizing a reliable intelligent ecosystem.
CEB server board equipped with Intel Xeon 600 processors for workstations.
- server
- Embedded Board Computers
ADLINK releases next-generation server boards equipped with Intel Xeon 600 processors for workstations and 2U/4U edge AI servers.
● Comprehensive portfolio expansion: ADLINK has introduced the Intel Xeon 6 series for workstations. This lineup, which includes the ISB-W890 board and AXE GPU server, enables the expansion of edge AI from traditional workloads to real-time generative AI and advanced analytics. ● Versatile high-performance architecture: A lineup designed for compute-intensive tasks such as intelligent automation and large-scale visual processing, ranging from flexible CEB server boards to 2U/4U GPU servers. ● Rapid deployment: Streamlines the transition from AI development to full-scale edge deployment with mission-critical reliability, reducing time to market.
Value Family 9th Generation Intel Xeon/Core i7/i5/i3 Processor Equipped Expandable Edge GPU Computer
- Industrial PCs
- Embedded Board Computers
A must-see for those interested in the deployment of edge AI! ADLINK will be presenting at GTC 21 (April 12-16)!
Artificial Intelligence (AI) heralds the arrival of a new era in computing, enabling greater innovation, productivity, and cost reduction. For edge applications where time and safety are critical, such as medical imaging and industrial-grade intelligent video analysis, edge AI solutions can better meet the stringent response times than cloud AI. By attending ADLINK's on-demand session at the NVIDIA GPU Technology Conference (GTC) held online from April 12 (Monday) to April 16 (Friday), 2021, you can learn how to accelerate edge AI development. - You will learn how edge AI is advancing medical and industrial applications. - You will gain insights into overcoming the challenges of edge AI. - You will hear about AI models and tools for video analysis. *Please note that ADLINK's session will be in English.
Mini-ITX embedded board equipped with 8th/9th generation Intel Core desktop processor.
- Embedded Board Computers
NVIDIA RTX A1000 built-in mobile PCI Express module
- Embedded Board Computers
ADLINK releases the first embedded MXM graphics module featuring the NVIDIA Ampere architecture for edge computing and AI.
● ADLINK's EGX-MXM-A1000, EGX-MXM-A2000, and EGX-MXM-A4500 are the first modules to adopt NVIDIA's embedded GPU based on the NVIDIA Ampere architecture. ● ADLINK's MXM graphics modules provide high-performance GPU acceleration in a compact and power-efficient MXM form factor, bringing edge computing and embedded AI to many vertical markets such as healthcare, manufacturing, and transportation. ● Robust design that withstands harsh temperature environments, shock, vibration, and corrosion under severe conditions.
NVIDIA RTX A500 built-in mobile PCI Express module
- Embedded Board Computers
![CPU module "SMARC" [LEC-MTK-I1200]](https://image.mono.ipros.com/public/product/image/e53/2000717097/IPROS58706350873575624420.jpeg?w=280&h=280){kind=small}
SMARC short-size module equipped with MediaTek Genio 1200 platform.
- Embedded Board Computers
ADLINK has released an AIoT SMARC module featuring the MediaTek SoC, equipped with an 8-core CPU and a 5-core GPU, known as the Genio 1200.
●A short-sized module based on the MediaTek Genio 1200 processor, designed to drive AIoT and 4K graphics applications at the edge, compliant with the SMARC 2.1 specification. ●It features a 2.2GHz octa-core (Cortex-A78 x4 + Cortex-A55 x4) CPU, a 5-core GPU for advanced 3D graphics, an integrated APU (AI Processor Unit) for on-device AI, and supports multiple 4K displays and camera inputs, all configured for excellent power efficiency.
Fanless computer equipped with 12th generation Intel processors from the Value Family.
- Industrial PCs
- Embedded Board Computers
ADLINK's next-generation IPC will revolutionize industrial use cases at the edge with its scalable design and custom function modules.
●Unmatched Performance: Equipped with 12th/13th generation Intel Core i9/i7/i5/i3 processors, achieving class-leading performance. ●Ultimate Flexibility: Modular and scalable design that is easy to expand, with optional FM modules to meet domain-specific requirements. ●AI-Ready Edge Platform: With built-in GPU power and machine vision capabilities, the ADLINK MVP-5200/6200 can instantly deploy AI-enabled applications.
Arm-based application-ready and programmable IoT gateway
- Industrial PCs
- Embedded Board Computers
ADLINK, application-compatible IIoT gateway, easily enables powerful end-to-end connectivity.
● The EMU-200 series comes with a built-in EGiFlow web console, simplifying data communication across different network systems. ● It supports major industrial communication protocols, meeting cross-industry requirements. ● It offers a rich variety of I/O interfaces and wireless support, making it suitable for monitoring decentralized or unmanned sites. ● It accommodates a wide temperature range of 40 to 70°C and can adapt to many harsh environments with diverse installation options.
Industrial ATX motherboard equipped with 12th/13th/14th generation Intel Core i9/i7/i5/i3 processors.
- Embedded Board Computers
ADLINK announces support for 14th generation Intel processors in cutting-edge industrial and AI solutions.
ADLINK adds support for the 14th generation Intel Core processors to its main product line, enhancing the performance and AI capabilities of diverse computing systems. This upgrade includes the IMB-M47, IMB-M47H motherboards, and NuPRO-E47 SBC, with the MVP-5200/MVP-6200 series scheduled for release in late 2024. The upgrade to the 14th generation processors demonstrates ADLINK's commitment to innovation in edge computing and AI, providing customers with advanced and future-proof technology.
Mini-ITX embedded board equipped with 8th/9th generation Intel Core i7/i5/i3 processors.
- Embedded Board Computers
3.5-inch single-board computer equipped with 13th generation Intel Core i7/i5/i3/Celeron processors.
- Embedded Board Computers
ADLINK releases a new 3.5-inch single-board computer for scalable edge AI and robust embedded applications.
●3.5 "Expanding the SBC Portfolio: ADLINK has announced the SBC35-MTL and SBC35-ASL, targeting both high-performance AI and robust embedded edge applications. ●AI Compatibility and Robust Design: The SBC35-MTL is equipped with an Intel Core Ultra featuring an NPU for real-time inference, while the SBC35-ASL is powered by the Intel Atom x7000RE, providing a wide temperature range and fanless operation. ●Flexible I/O with SBC-FM Modules: Both models support ADLINK's SBC-FM expansion modules, enabling customized I/O to accelerate deployment across various industries.
NXP i.MX95 series processor equipped OSM R1.2 Size L module
- Embedded Board Computers
ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!
This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution
NVIDIA RTX ADA 5000 built-in MXM GPU module
- Embedded Board Computers
3U CompactPCI Quad-Core Intel Atom Processor X Series Blade
- Embedded Board Computers
- Expansion Boards
Robust 3UVPX Intel Xeon and 9th generation Core i3 processor blade
- Embedded Board Computers